DIE-CUTTING DEVICE

A die-cutting device includes a conveying mechanism configured to convey an electrode plate including uncoated and coated regions connected to each other, a cutting mechanism located on one side of the electrode plate in a thickness direction and configured to cut the uncoated region to form a scrap portion and a tab connected to the coated region, a first limiting member located between the electrode plate and the cutting mechanism in the thickness direction and provided with a cutting hole that allows laser light from the cutting mechanism to pass through and matches a cutting trajectory of the laser light, and a second limiting member located on a side of the electrode plate facing away from the first limiting member in the thickness direction and configured to cooperate with the first limiting member to limit the electrode plate in the thickness direction.