ELECTRODE SHEET DIE-CUTTING METHOD AND ELECTRODE SHEET DIE-CUTTING DEVICE

The present disclosure provides an electrode plate die-cutting method and an electrode plate die-cutting device. The electrode plate die-cutting method includes: conveying an electrode plate material strip in a first direction to a cutting area of an electrode plate die-cutting device; and adjusting, based on the electrode plate material strip, a position of each of a first laser cutting assembly and a second laser cutting assembly of the electrode plate die-cutting device to position a center point of a first laser galvanometer of the first laser cutting assembly above a predetermined electrode plate cutting line and to position a center point of a second laser galvanometer of the second laser cutting assembly above the tab cutting area.