INCLINATION SENSOR, METHOD OF MANUFACTURING INCLINATION SENSOR, AND METHOD OF MEASURING INCLINATION

The sensor has silicon substrate (1) whose both ends are supported by a support structure (2), and a weight (3) that is installed at center of silicon substrate through a projected portion (3a). The substrate has piezoresistances (R1- R4) formed with deformable thickness. Independent claims are also included for the following: (1) inclination sensor manufacturing method; and (2) inclination measuring method.