{
  "$type": "site.standard.document",
  "description": "The sensor has silicon substrate (1) whose both ends are supported by a support structure (2), and a weight (3) that is installed at center of silicon substrate through a projected portion (3a). The substrate has piezoresistances (R1- R4) formed with deformable thickness. Independent claims are…",
  "path": "/patents/1081248",
  "publishedAt": "2004-12-29T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G01C9/06",
    "ASAHI KASEI EMD CORP [JP]"
  ],
  "textContent": "The sensor has silicon substrate (1) whose both ends are supported by a support structure (2), and a weight (3) that is installed at center of silicon substrate through a projected portion (3a). The substrate has piezoresistances (R1- R4) formed with deformable thickness. Independent claims are also included for the following: (1) inclination sensor manufacturing method; and (2) inclination measuring method.",
  "title": "INCLINATION SENSOR, METHOD OF MANUFACTURING INCLINATION SENSOR, AND METHOD OF MEASURING INCLINATION"
}