DAMPING COVERS FOR POWER INVERTER MODULES AND INTEGRATED POWER ELECTRONICS MODULES UTILIZING THE SAME

A damping cover for an integrated power electronics module (IPEM), the damping cover generally defined by a top side and a bottom side, wherein the bottom side is configured to mate adjacent with or contiguous to a power inverter module (PIM) of the IPEM. The damping cover can include an aluminum foam core including a top surface generally corresponding to the top side of the damping cover and a bottom surface generally corresponding to the bottom side of the damping cover and a polymeric over-molding or non-porous aluminum outer layer covering the top surface and/or a polymeric over-molding or non-porous aluminum outer layer covering the bottom surface. The bottom side of the damping cover can mate adjacent with or contiguous to the PIM. The polymeric material over-molding can completely impregnate the aluminum foam core. The aluminum foam core can have a density of about 0.15 g/cmto about 1.0 g/cm.