{
  "$type": "site.standard.document",
  "description": "A damping cover for an integrated power electronics module (IPEM), the damping cover generally defined by a top side and a bottom side, wherein the bottom side is configured to mate adjacent with or contiguous to a power inverter module (PIM) of the IPEM. The damping cover can include an aluminum…",
  "path": "/patents/1283037",
  "publishedAt": "2021-02-04T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H05K5/03",
    "GM GLOBAL TECHNOLOGY OPERATIONS LLC"
  ],
  "textContent": "A damping cover for an integrated power electronics module (IPEM), the damping cover generally defined by a top side and a bottom side, wherein the bottom side is configured to mate adjacent with or contiguous to a power inverter module (PIM) of the IPEM. The damping cover can include an aluminum foam core including a top surface generally corresponding to the top side of the damping cover and a bottom surface generally corresponding to the bottom side of the damping cover and a polymeric over-molding or non-porous aluminum outer layer covering the top surface and/or a polymeric over-molding or non-porous aluminum outer layer covering the bottom surface. The bottom side of the damping cover can mate adjacent with or contiguous to the PIM. The polymeric material over-molding can completely impregnate the aluminum foam core. The aluminum foam core can have a density of about 0.15 g/cmto about 1.0 g/cm.",
  "title": "DAMPING COVERS FOR POWER INVERTER MODULES AND INTEGRATED POWER ELECTRONICS MODULES UTILIZING THE SAME"
}