PLATE WITH ACOUSTIC BLACK HOLES

An integrated power electronics (IPE) module is provided. The IPE module includes an IPE casing including at least one panel and a power inverter module (PIM) carrying the IPE casing. The PIM is housed within an internal chamber. The panel includes an acoustic black hole plate having an acoustic black hole zone including at least one acoustic black hole. Each acoustic black hole includes a geometric center and a damper. The acoustic black hole plate has a decreasing acoustic black hole plate thickness from an outer edge of the acoustic black hole to the geometric center, and the decreasing acoustic black hole plate thickness traps vibration energy for efficiency attenuation. The damper is coupled to the acoustic black hole plate and is located at the geometric center.