DEVICE FOR THERMAL PROCESSING OF AN ELECTRICAL ELEMENT LIABLE TO GET HOT AND METHOD IMPLEMENTING THE THERMAL PROCESSING DEVICE

The invention relates to a device () for thermal processing of at least one electrical element placed in a chamber () and liable to get hot, the thermal processing device () comprising at least one first circuit configured to be passed through by a heat-transfer fluid and at least one second circuit configured to be passed through by a dielectric fluid, characterised in that the first circuit and the second circuit are at least partially bounded by a face placed facing the chamber (). The invention also relates to an electrical device () comprising a casing (), a plurality of electrical elements liable to get hot and a thermal processing device (). The invention relates to a method for cooling a plurality of electrical elements liable to get hot of an electrical device ().