{
  "$type": "site.standard.document",
  "coverImage": {
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  "description": "The invention relates to a device () for thermal processing of at least one electrical element placed in a chamber () and liable to get hot, the thermal processing device () comprising at least one first circuit configured to be passed through by a heat-transfer fluid and at least one second…",
  "path": "/patents/1314459",
  "publishedAt": "2022-03-31T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M10/6569",
    "Valeo Systemes Thermiques"
  ],
  "textContent": "The invention relates to a device () for thermal processing of at least one electrical element placed in a chamber () and liable to get hot, the thermal processing device () comprising at least one first circuit configured to be passed through by a heat-transfer fluid and at least one second circuit configured to be passed through by a dielectric fluid, characterised in that the first circuit and the second circuit are at least partially bounded by a face placed facing the chamber (). The invention also relates to an electrical device () comprising a casing (), a plurality of electrical elements liable to get hot and a thermal processing device (). The invention relates to a method for cooling a plurality of electrical elements liable to get hot of an electrical device ().",
  "title": "DEVICE FOR THERMAL PROCESSING OF AN ELECTRICAL ELEMENT LIABLE TO GET HOT AND METHOD IMPLEMENTING THE THERMAL PROCESSING DEVICE"
}