SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, VEHICLE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Provided is a semiconductor device including: a laminated substrate in which a circuit layer, an insulating layer, and a metal layer are sequentially laminated. A slit is formed in the circuit layer. A recess recessed from one surface side facing the insulating layer toward the other surface side is formed in the metal layer. The recess of the metal layer has a relaxation portion at least partially overlapping the slit of the circuit layer in a planar view.