SEMICONDUCTOR DEVICE AND VEHICLE

A semiconductor device, including: a semiconductor element that has, formed at a first surface thereof: a pair of metal layers adjacent to each other, and an insulating layer interposed between the pair of metal layers; a metal wiring board that is bonded to the pair of metal layers of the semiconductor element respectively via a pair of bonding materials, the metal wiring board including a pair of regions thereof respectively overlapping with the pair of metal layers in a plan view of the semiconductor device; and a separation portion provided between the semiconductor element and the metal wiring board, and separating the pair of regions of the metal wiring board.