SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, MOVING BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

An object of the present invention is to provide a technique capable of suppressing displacement of an electronic component and a solder ball without using a jig. A semiconductor device includes an insulating substrate, an electronic component, and solder. A metal pattern and a semiconductor element are disposed on the insulating substrate. The metal pattern has a first recess and a second recess that are provided side by side. A part of the electronic component is disposed in the first recess. The solder connects the metal pattern disposed on the insulating substrate and the electronic component.