{
  "$type": "site.standard.document",
  "description": "An object of the present invention is to provide a technique capable of suppressing displacement of an electronic component and a solder ball without using a jig. A semiconductor device includes an insulating substrate, an electronic component, and solder. A metal pattern and a semiconductor…",
  "path": "/patents/1344400",
  "publishedAt": "2023-05-25T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H05K1/111",
    "Mitsubishi Electric Corporation"
  ],
  "textContent": "An object of the present invention is to provide a technique capable of suppressing displacement of an electronic component and a solder ball without using a jig. A semiconductor device includes an insulating substrate, an electronic component, and solder. A metal pattern and a semiconductor element are disposed on the insulating substrate. The metal pattern has a first recess and a second recess that are provided side by side. A part of the electronic component is disposed in the first recess. The solder connects the metal pattern disposed on the insulating substrate and the electronic component.",
  "title": "SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, MOVING BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE"
}