POWER SEMICONDUCTOR MODULE

Provided is a power semiconductor module wherein stress generated at a soldering section of a relay terminal is relaxed. A power semiconductor module (1) is provided with a substrate (2), relay terminals (9, 10), external connecting terminals (13, 14), and a relay terminal holding member (6). The relay terminals (9, 10) are connected to the substrate (2) with a solder (4) therebetween. The external connecting terminals (13, 14) are bonded to the relay terminals (9, 10), respectively. The non-conductive relay terminal holding member (6) holds end portions of the relay terminals (9, 10), said end portions being on the side bonded to the solder (4).