Terminal holding and heat dissipation structure

In a structure for holding a terminal in which a soldering portion of the terminal is inserted into a connecting hole of a substrate, and a land portion on the substrate and the soldering portion of the terminal are held by soldering with the terminal set upright, a terminal plate for guiding the soldering portion of the terminal into the connecting hole of the substrate is disposed at a position opposing the substrate and spaced apart therefrom with a predetermined clearance, and a positioning hole for holding an intermediate portion of the terminal is provided in the terminal plate, while a retaining portion which is retained in the positioning hole of the terminal plate is provided in the intermediate portion of the terminal.