Angular rate sensor

An angular rate sensor includes a metallic core board 2 having a core metal layer 1 made of a metal plate and a wiring layer 18 including a wiring structure, a semiconductor device 3 for detecting an angular rate fixed on the core metal layer 1, and a cap 4 fixed to the wiring layer 18. The semiconductor device 3 for detecting an angular rate is disposed in a hollow chamber formed by the cap and the metallic core board 2. The metallic core board 2, the semiconductor device 3, and the cap 4 are molded with resin 20. Consequently, the angular rate sensor has a packaging structure in which electromagnetic noise resistance and moisture resistance are improved while stress applied to the semiconductor device 3 for detecting an angular rate is reduced.