{
  "$type": "site.standard.document",
  "description": "An angular rate sensor includes a metallic core board 2 having a core metal layer 1 made of a metal plate and a wiring layer 18 including a wiring structure, a semiconductor device 3 for detecting an angular rate fixed on the core metal layer 1, and a cap 4 fixed to the wiring layer 18. The…",
  "path": "/patents/1009518",
  "publishedAt": "2011-09-14T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G01C19/56",
    "HITACHI AUTOMOTIVE SYSTEMS LTD [JP]"
  ],
  "textContent": "An angular rate sensor includes a metallic core board 2 having a core metal layer 1 made of a metal plate and a wiring layer 18 including a wiring structure, a semiconductor device 3 for detecting an angular rate fixed on the core metal layer 1, and a cap 4 fixed to the wiring layer 18. The semiconductor device 3 for detecting an angular rate is disposed in a hollow chamber formed by the cap and the metallic core board 2. The metallic core board 2, the semiconductor device 3, and the cap 4 are molded with resin 20. Consequently, the angular rate sensor has a packaging structure in which electromagnetic noise resistance and moisture resistance are improved while stress applied to the semiconductor device 3 for detecting an angular rate is reduced.",
  "title": "Angular rate sensor"
}