Manufacturing Method For Electronic Device And Electronic DeviceA manufacturing method for an electronic device includes a housing step of housing a vibrator element in a housing space formed by a substrate and a lid member, and an adjustment step of adjusting a r…DRIVE·May 16·1 min readFollowG01C19/5783SEIKO EPSON CORPORATION
SENSOR DEVICE AND SENSORA sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically co…DRIVE·Nov 17·1 min readFollowG01C19/5783Panasonic Intellectual Property Management Co., Ltd.
DIFFUSION BLOCK FOR AN EVACUATED INSTRUMENT SYSTEMOne example includes an instrument system. The system includes instrument components at least partially disposed in an evacuated chamber within an instrument housing. The system also includes a barrie…DRIVE·Sep 22·1 min readFollowG01C19/5783NORTHROP GRUMMAN SYSTEMS CORPORATION
SENSOR AND ELECTRONIC DEVICEAccording to one embodiment, a sensor includes a sensor part including first and second sensor elements, and a circuit part. The first sensor element includes a first supporter, a first movable part c…DRIVE·Aug 25·1 min readFollowG01C19/5783KABUSHIKI KAISHA TOSHIBA
THREE DIMENSIONAL MICROSTRUCTURES WITH SELECTIVELY REMOVED REGIONS FOR USE IN GYROSCOPES AND OTHER DEVICESThree-dimensional (3D) micro-scale shells are presented with openings of various sizes and geometries on the surface. The shell consist of a suspended ring-shaped resonator, multiple support beams, a …DRIVE·Mar 24·1 min readFollowG01C19/5783THE REGENTS OF THE UNIVERSITY OF MICHIGAN
SENSOR DEVICEA sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrica…DRIVE·Feb 24·1 min readFollowG01C19/5783PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Single package imaging and inertial navigation sensors, and methods of manufacturing the sameApparatus and methods of manufacturing an image sensor and inertial navigation sensors encapsulated within a single package. The single package may encapsulate one integrated circuit die comprising th…DRIVE·Sep 4·1 min readFollowG01C19/5783BLACKBERRY LTD [CA]
Module and electronic apparatusA module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having f…DRIVE·Dec 5·1 min readFollowG01C19/5783SEIKO EPSON CORP [JP]
System and structure for supporting vibratorsAn object of the present invention is to provide a novel system for supporting a vibrator having a terminal for electrical connection so that the vibrator may be miniaturized and the deviation of vibr…DRIVE·Aug 6·1 min readFollowG01C19/5783NGK INSULATORS LTD [JP]
