MANUFACTURING METHOD OF A CIRCUIT BOARD ASSEMBLY

A circuit board assembly (8) includes a wiring board (81), a coin-type secondary cell (1) that is a lithium secondary cell electrically connected to the wiring board (81) by reflow soldering, and a wireless communication device (82) electrically connected to the wiring board (81). The coin-type secondary cell (1) includes a positive electrode including a sintered body, a negative electrode including a sintered body, an electrolyte layer provided between the positive electrode and the negative electrode, and a cell case having an enclosed space in which the positive electrode, the negative electrode, and the electrolyte layer are housed. When C is given as the capacity of the positive electrode and A is given as the capacity of the negative electrode, 1.03 < C/A < 1.60 is satisfied.