{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
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    "mimeType": "image/png",
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  "description": "A circuit board assembly (8) includes a wiring board (81), a coin-type secondary cell (1) that is a lithium secondary cell electrically connected to the wiring board (81) by reflow soldering, and a wireless communication device (82) electrically connected to the wiring board (81). The coin-type…",
  "path": "/patents/1418429",
  "publishedAt": "2025-08-20T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M10/0436",
    "NGK INSULATORS LTD [JP]"
  ],
  "textContent": "A circuit board assembly (8) includes a wiring board (81), a coin-type secondary cell (1) that is a lithium secondary cell electrically connected to the wiring board (81) by reflow soldering, and a wireless communication device (82) electrically connected to the wiring board (81). The coin-type secondary cell (1) includes a positive electrode including a sintered body, a negative electrode including a sintered body, an electrolyte layer provided between the positive electrode and the negative electrode, and a cell case having an enclosed space in which the positive electrode, the negative electrode, and the electrolyte layer are housed. When C is given as the capacity of the positive electrode and A is given as the capacity of the negative electrode, 1.03 < C/A < 1.60 is satisfied.",
  "title": "MANUFACTURING METHOD OF A CIRCUIT BOARD ASSEMBLY"
}