APPARATUS FOR SECURING TOGETHER A BUNDLE OF CONDUCTORS

An apparatus used in securing together a bundle of conductors has a support structure with an edge surface having a plurality of notches provided in the edge surface. Each notch of the plurality of notches has an open space dimensioned for receiving a bundle of conductors in the open space. A plurality of clamps are provided that are attachable to the edge surface with each clamp extending over a notch of the plurality of notches and over a bundle of conductors positioned in the open space of the notch. The clamps attached to the edge surface of the support structure over the bundle of conductors positioned in the notch in the edge surface secures the bundle of conductors in the open space of the notch.