APPARATUS FOR FORMING A WIRE BUNDLE AND COUPLING THE WIRE BUNDLE TO A STRUCTURE

A wire bundle forming apparatus including a wire bundle form board having a plurality of mounting structure couplings, and at least one wire bundle mounting structure configured to couple with the plurality of mounting structure couplings for removably coupling the at least one wire bundle mounting structure to the wire bundle form board in a predetermined pattern corresponding to a predetermined configuration of a wire bundle. The at least one wire bundle mounting structure has a wire receiving portion. The at least one wire bundle mounting structure is common to both arranging at least one wire in the predetermined configuration for formation of the wire bundle, and, when removed from the wire bundle form board with the wire bundle coupled to the at least one wire bundle mounting structure, a fixture for coupling the wire bundle to a structure.