FILM FORMING METHOD AND FILM FORMING DEVICE

A film forming method includes applying liquids to a material by discharging the liquids from each of a plurality of discharge heads disposed along a transport direction of the material. Each of the discharge heads has a plurality of liquid discharge nozzles disposed along a direction intersecting the transport direction. The applying includes applying at least a first liquid, a second liquid, and a third liquid from each of the plurality of discharge heads. The second liquid is applied to a position substantially equal to a position to which the first liquid is applied along a width direction. The third liquid is applied to an intermediate position between the position to which the first liquid is applied and the position to which the second liquid is applied along the transport direction, the intermediate position being different from the position to which the first liquid is applied along the width direction.