MICROELECTROMECHANICAL DEVICE WITH OUT-OF-PLANE STOPPER STRUCTURE AND PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL DEVICE

A microelectromechanical device includes a substrate (21), a first structural layer (23), and a second structural layer (25) of semiconductor material. A sensing mass (32; 132) extends in the first structural layer (23) and is coupled to the substrate (21) by first elastic connections (35) that oscillate in a sensing direction (Z) perpendicular to the substrate (21), with a maximum elongation with respect to a resting position. An out-of-plane stopper structure (38) includes an anchorage (39) fixed to the substrate (21) and a mechanical end-of-travel structure (40), which extends in the second structural layer (25), faces the sensing mass (32), and is separated therefrom by a gap (41) having a width (W) smaller than the maximum elongation. The mechanical end-of-travel structure (40) is coupled to the anchorage (39) by second elastic connections (42) that enable shifts of the mechanical end-of-travel structure (40) with respect to the sensing direction (Z) in response to an impact of the sensing mass (32).