A PACK FOR MOUNTING AN ELECTRONIC DEVICE TO A TIRE

The present invention relates to an electrical device pack comprising an adhesive layer deposited onto a transfer layer, an electrical device, such as an RFID transponder, deposited onto said adhesive layer and a tear-off cover in order to protect said electrical device. The electrical device pack of the invention provides a ready to use electrical device that can be directly applied onto the uncured rubber of a tire product without requiring further processing. The present invention also discloses a method for attaching an electrical device to a tire using said electrical device pack which allows exact positioning of the tag on the desired location and in a desired alignment on the tire without overhandling the tag and causing damage.