{
  "$type": "site.standard.document",
  "description": "The present invention relates to an electrical device pack comprising an adhesive layer deposited onto a transfer layer, an electrical device, such as an RFID transponder, deposited onto said adhesive layer and a tear-off cover in order to protect said electrical device. The electrical device pack…",
  "path": "/patents/1394771",
  "publishedAt": "2025-08-06T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B29D30/0061",
    "SES RFID SOLUTIONS GMBH [DE]"
  ],
  "textContent": "The present invention relates to an electrical device pack comprising an adhesive layer deposited onto a transfer layer, an electrical device, such as an RFID transponder, deposited onto said adhesive layer and a tear-off cover in order to protect said electrical device. The electrical device pack of the invention provides a ready to use electrical device that can be directly applied onto the uncured rubber of a tire product without requiring further processing. The present invention also discloses a method for attaching an electrical device to a tire using said electrical device pack which allows exact positioning of the tag on the desired location and in a desired alignment on the tire without overhandling the tag and causing damage.",
  "title": "A PACK FOR MOUNTING AN ELECTRONIC DEVICE TO A TIRE"
}