PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND BATTERY PACK COMPRISING SAME

A printed circuit board according to one embodiment of the present disclosure includes an inner layer; a first insulating layer formed on an upper part of the inner layer; a first copper foil layer formed on an upper part of the first insulating layer; and a solder resist layer formed on an upper part of the first copper foil layer, wherein when welding a metal tab onto the solder resist layer, a welding portion that couples the metal tab and the first copper foil layer is formed, and a gap is formed at a portion adjacent to the welding portion.