{
  "$type": "site.standard.document",
  "description": "A printed circuit board according to one embodiment of the present disclosure includes an inner layer; a first insulating layer formed on an upper part of the inner layer; a first copper foil layer formed on an upper part of the first insulating layer; and a solder resist layer formed on an upper…",
  "path": "/patents/1392023",
  "publishedAt": "2026-04-01T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01M10/425",
    "LG ENERGY SOLUTION LTD [KR]"
  ],
  "textContent": "A printed circuit board according to one embodiment of the present disclosure includes an inner layer; a first insulating layer formed on an upper part of the inner layer; a first copper foil layer formed on an upper part of the first insulating layer; and a solder resist layer formed on an upper part of the first copper foil layer, wherein when welding a metal tab onto the solder resist layer, a welding portion that couples the metal tab and the first copper foil layer is formed, and a gap is formed at a portion adjacent to the welding portion.",
  "title": "PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND BATTERY PACK COMPRISING SAME"
}