ELECTRODE PLATE SUPPORTING DEVICE, LASER CUTTING APPARATUS, AND LASER CUTTING METHOD FOR ELECTRODE PLATE

The present disclosure provides an electrode plate supporting device, a laser cutting apparatus and a laser cutting method for an electrode plate. The electrode plate supporting device is used in coordination with the laser assembly and includes a body constructed with an abutting surface for abutting against an electrode plate to tension the electrode plate. The laser assembly is configured to emit laser to the abutting surface. During laser cutting, the electrode plate abuts against the abutting surface and closely fits the abutting surface to extend fully and thus is in a flattened state, and therefore, the problem of defocusing caused by a wavy edge is solved. Moreover, supported by the abutting surface, the electrode plate is tensioned and not prone to shaking, and therefore, problems such as failing to cut off the incoming material due to easy shaking of the electrode plate are effectively solved. The cutting quality of a tab can be improved and the use safety of a battery can be improved.