DEVICE WITH SEMICONDUCTOR COMPONENT MOUNTED ON A HEAT SINK, MOUNTING METHOD, AND LIGHTING DEVICE FOR A MOTOR VEHICLE COMPRISING SUCH A DEVICE

Device comprising at least one semiconductor component (1) connected to an electrical interconnection element (5), which electrical interconnection element (5) is fixed on a heat dissipator (2) and connected to a bundle (3) of electrical wires, the bundle (3) being mechanically and electrically connected to the electrical interconnection element (5) by a single connector (7), the bundle (3) being connected to the heat dissipator (2) by a holding means (8).