POWER ELECTRONICS HEAT REMOVAL

A power electronics converter includes a multi-layer planar carrier substrate having a plurality of electrically conductive layers, at least one electrical connection, and a converter commutation cell comprising a power circuit and a gate driver circuit. The power circuit includes at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element is included in a power semiconductor prepackage having one or more power semiconductor switching elements embedded in a solid insulating material. The power electronics converter includes a heat sink configured to remove heat from the power semiconductor prepackage. A converter parameter η is greater than or 20 equal to 100 kW/m3K, η being defined as a heat transfer coefficient between the heat removal side of the power semiconductor prepackage and a cooling medium of the heat sink divided by the size of a gap between the power semiconductor prepackage and the heat sink.