{
  "$type": "site.standard.document",
  "description": "A power electronics converter includes a multi-layer planar carrier substrate having a plurality of electrically conductive layers, at least one electrical connection, and a converter commutation cell comprising a power circuit and a gate driver circuit. The power circuit includes at least one…",
  "path": "/patents/1355499",
  "publishedAt": "2023-11-30T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "H01L25/16",
    "Rolls-Royce Deutschland Ltd & Co KG"
  ],
  "textContent": "A power electronics converter includes a multi-layer planar carrier substrate having a plurality of electrically conductive layers, at least one electrical connection, and a converter commutation cell comprising a power circuit and a gate driver circuit. The power circuit includes at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element is included in a power semiconductor prepackage having one or more power semiconductor switching elements embedded in a solid insulating material. The power electronics converter includes a heat sink configured to remove heat from the power semiconductor prepackage. A converter parameter η is greater than or 20 equal to 100 kW/m3K, η being defined as a heat transfer coefficient between the heat removal side of the power semiconductor prepackage and a cooling medium of the heat sink divided by the size of a gap between the power semiconductor prepackage and the heat sink.",
  "title": "POWER ELECTRONICS HEAT REMOVAL"
}