Sheet Metal Enclosure with an Array of Extruded Heat Transfer Holes

Described herein is an enclosure comprising at least one planar portion with an array of extruded holes disposed thereon. The holes are extruded along an axis normal to a plane of the planar portion and configured as apertures for heat transfer through the enclosure. The holes have an inner diameter and have a height along the axis relative to the plane, which provide greater stiffness to the planar portion compared to non-extruded holes. Techniques for producing enclosures with extruded holes such as this are also described. A schematic of an array of extruded holes can be generated by determining, based on a predetermined pilot hole diameter, a thickness of an associated portion of sheet metal, and a hole diameter, an extruded height usable for the extruded holes in the schematic. This may allow for simple conversion from an array of non-extruded thru holes to an array of extruded holes.