{
  "$type": "site.standard.document",
  "description": "Described herein is an enclosure comprising at least one planar portion with an array of extruded holes disposed thereon. The holes are extruded along an axis normal to a plane of the planar portion and configured as apertures for heat transfer through the enclosure. The holes have an inner…",
  "path": "/patents/1356864",
  "publishedAt": "2023-12-28T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60R16/0239",
    "Aptiv Technologies Limited"
  ],
  "textContent": "Described herein is an enclosure comprising at least one planar portion with an array of extruded holes disposed thereon. The holes are extruded along an axis normal to a plane of the planar portion and configured as apertures for heat transfer through the enclosure. The holes have an inner diameter and have a height along the axis relative to the plane, which provide greater stiffness to the planar portion compared to non-extruded holes. Techniques for producing enclosures with extruded holes such as this are also described. A schematic of an array of extruded holes can be generated by determining, based on a predetermined pilot hole diameter, a thickness of an associated portion of sheet metal, and a hole diameter, an extruded height usable for the extruded holes in the schematic. This may allow for simple conversion from an array of non-extruded thru holes to an array of extruded holes.",
  "title": "Sheet Metal Enclosure with an Array of Extruded Heat Transfer Holes"
}