WIRE BONDING DEFECT DETECTION APPARATUS AND OPERATION METHOD THEREOF

An apparatus and method are disclosed for detecting a bonding defect occurring during an ultrasonic wire bonding process between a battery cell and a busbar connected to each other by ultrasonic wire bonding. A bonding parameter collector, coupled to an ultrasonic wire bonding machine, may collect ultrasonic bonding parameters continuously during the ultrasonic wire bonding process, machine learning training may be performed by a convolutional neural network, and a bonding defect may be detected based thereon.