INDUCTIVE COUPLING SYSTEM AND METHOD FOR ADAPTIVE CONTROL OF POWER TRANSFER FOR WIRELESS THREE-DIMENSIONAL STACKED CHIP PACKAGE

Disclosed is an inductive coupling system and method for adaptive control of power transfer for a wireless three-dimensional stacked chip package. The system includes a slave chip and a master chip connected via inductive coupling; the system for adaptive control of power transfer herein shifts a load feedback voltage received by the slave chip into a feedback voltage data codeword through a level decision circuit, and the system can load the feedback voltage data codeword onto a data link of the system and feedback same to the master chip. In the present disclosure, the master chip includes a DPID control circuit controls a voltage-controlled oscillator and a frequency divider to adjust the frequency of an input clock in an energy transfer system so as to achieve adaptive control of the transmitting power of a transmitting chip.