THERMAL CONDITIONING SYSTEM

The invention relates to a thermal conditioning system including a heat-transfer circuit, a refrigerant circuit including successively: a compressor, a first bi-fluid exchanger and a second bi-fluid exchanger arranged jointly on the refrigerant circuit and on a main loop of the heat-transfer circuit, a first expansion valve, a third bi-fluid exchanger arranged jointly on the refrigerant circuit and on a secondary loop of the heat-transfer circuit, a first branch of the heat-transfer circuit being configured so that the heat-transfer liquid leaving the first bi-fluid exchanger returns to the first bi-fluid exchanger without passing through the second bi-fluid exchanger, and including a second heat exchanger configured to exchange with a second air flow. A second branch connects the first branch to the main loop, and includes a third heat exchanger configured to exchange with the second air flow.