{
  "$type": "site.standard.document",
  "description": "The invention relates to a thermal conditioning system including a heat-transfer circuit, a refrigerant circuit including successively: a compressor, a first bi-fluid exchanger and a second bi-fluid exchanger arranged jointly on the refrigerant circuit and on a main loop of the heat-transfer…",
  "path": "/patents/1364369",
  "publishedAt": "2024-06-06T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60H1/323",
    "VALEO SYSTEMES THERMIQUES"
  ],
  "textContent": "The invention relates to a thermal conditioning system including a heat-transfer circuit, a refrigerant circuit including successively: a compressor, a first bi-fluid exchanger and a second bi-fluid exchanger arranged jointly on the refrigerant circuit and on a main loop of the heat-transfer circuit, a first expansion valve, a third bi-fluid exchanger arranged jointly on the refrigerant circuit and on a secondary loop of the heat-transfer circuit, a first branch of the heat-transfer circuit being configured so that the heat-transfer liquid leaving the first bi-fluid exchanger returns to the first bi-fluid exchanger without passing through the second bi-fluid exchanger, and including a second heat exchanger configured to exchange with a second air flow. A second branch connects the first branch to the main loop, and includes a third heat exchanger configured to exchange with the second air flow.",
  "title": "THERMAL CONDITIONING SYSTEM"
}