POWER MODULE AND POWER CONVERSION APPARATUS USING SAME

A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and the conductive plates, wherein the module case includes a heat radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening portion that is closed by the heat radiation member, and wherein a heat radiation fin unit having a plurality of heat radiation fins vertically arranged thereon is provided at a center of the heat radiation member, and a joint portion with the frame body is provided at an external peripheral edge of the heat radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body is of a higher rigidity than that of the heat radiation member.