{
  "$type": "site.standard.document",
  "description": "A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and the…",
  "path": "/patents/976171",
  "publishedAt": "2014-04-16T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60L50/16",
    "HITACHI AUTOMOTIVE SYSTEMS LTD [JP]"
  ],
  "textContent": "A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and the conductive plates, wherein the module case includes a heat radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening portion that is closed by the heat radiation member, and wherein a heat radiation fin unit having a plurality of heat radiation fins vertically arranged thereon is provided at a center of the heat radiation member, and a joint portion with the frame body is provided at an external peripheral edge of the heat radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body is of a higher rigidity than that of the heat radiation member.",
  "title": "POWER MODULE AND POWER CONVERSION APPARATUS USING SAME"
}