{
  "$type": "site.standard.document",
  "description": "The present disclosure provides an electrode plate die-cutting method and an electrode plate die-cutting device. The electrode plate die-cutting method includes: conveying an electrode plate material strip in a first direction to a cutting area of an electrode plate die-cutting device; and…",
  "path": "/patents/1380320",
  "publishedAt": "2026-04-02T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B23K26/38",
    "EVE POWER CO., LTD."
  ],
  "textContent": "The present disclosure provides an electrode plate die-cutting method and an electrode plate die-cutting device. The electrode plate die-cutting method includes: conveying an electrode plate material strip in a first direction to a cutting area of an electrode plate die-cutting device; and adjusting, based on the electrode plate material strip, a position of each of a first laser cutting assembly and a second laser cutting assembly of the electrode plate die-cutting device to position a center point of a first laser galvanometer of the first laser cutting assembly above a predetermined electrode plate cutting line and to position a center point of a second laser galvanometer of the second laser cutting assembly above the tab cutting area.",
  "title": "ELECTRODE SHEET DIE-CUTTING METHOD AND ELECTRODE SHEET DIE-CUTTING DEVICE"
}