SENSOR DIE

Apparatuses, systems, and methods are provided for sensor dies, particularly silicon-based polymer sensor dies. A sensor die may be configured, via a plurality of interdigitated electrode (IDEs) and a sensing layer, to measure variations in impedance to detect presence of a material (e.g., a leakage from a battery). The sensor die may comprise a substrate comprised of a silicon oxide on silicon wafer, the plurality of IDEs (e.g., comprised of a metal) disposed proximate to a surface of the substrate, one or more retaining rings defining one or more regions therebetween configured to contain at least a volume of the material, and the sensing layer (e.g., comprised of solid polymer electrolyte (SPE)) disposed proximate to the plurality of IDEs.