{
  "$type": "site.standard.document",
  "description": "Apparatuses, systems, and methods are provided for sensor dies, particularly silicon-based polymer sensor dies. A sensor die may be configured, via a plurality of interdigitated electrode (IDEs) and a sensing layer, to measure variations in impedance to detect presence of a material (e.g., a…",
  "path": "/patents/1382655",
  "publishedAt": "2026-05-14T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "G01N27/028",
    "Honeywell International Inc."
  ],
  "textContent": "Apparatuses, systems, and methods are provided for sensor dies, particularly silicon-based polymer sensor dies. A sensor die may be configured, via a plurality of interdigitated electrode (IDEs) and a sensing layer, to measure variations in impedance to detect presence of a material (e.g., a leakage from a battery). The sensor die may comprise a substrate comprised of a silicon oxide on silicon wafer, the plurality of IDEs (e.g., comprised of a metal) disposed proximate to a surface of the substrate, one or more retaining rings defining one or more regions therebetween configured to contain at least a volume of the material, and the sensing layer (e.g., comprised of solid polymer electrolyte (SPE)) disposed proximate to the plurality of IDEs.",
  "title": "SENSOR DIE"
}