Stackable module

Stackable module (2) comprises a spacer (1) based on a hot-melt adhesive binder adhering to its surface. Independent claims are also included for the following: (1) producing the module by heating the spacer, or the module surface at least in the planned region of application of the spacer, to a temperature above the m.pt. of the hot-melt adhesive binder, contacting the module surface and spacer, and cooling the spacer to room temperature; (2) adhering the module by taking a module from a stack, melting the spacer and contacting the molten spacer with another surface; and (3) adhering the module by taking a module from a stack, contacting the spacer with another surface, melting the spacer and cooling the spacer to room temperature.