{
  "$type": "site.standard.document",
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreic3rff6du4mltl3l776ge47xqq4vwgi43rqlyjys5dgvqela5dxnu"
    },
    "mimeType": "image/png",
    "size": 80472
  },
  "description": "Stackable module (2) comprises a spacer (1) based on a hot-melt adhesive binder adhering to its surface. Independent claims are also included for the following: (1) producing the module by heating the spacer, or the module surface at least in the planned region of application of the spacer, to a…",
  "path": "/patents/1082521",
  "publishedAt": "2004-11-10T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "B60J1/004",
    "SIKA TECHNOLOGY AG [CH]"
  ],
  "textContent": "Stackable module (2) comprises a spacer (1) based on a hot-melt adhesive binder adhering to its surface. Independent claims are also included for the following: (1) producing the module by heating the spacer, or the module surface at least in the planned region of application of the spacer, to a temperature above the m.pt. of the hot-melt adhesive binder, contacting the module surface and spacer, and cooling the spacer to room temperature; (2) adhering the module by taking a module from a stack, melting the spacer and contacting the molten spacer with another surface; and (3) adhering the module by taking a module from a stack, contacting the spacer with another surface, melting the spacer and cooling the spacer to room temperature.",
  "title": "Stackable module"
}