TSMC Advances CoPoS and Glass Substrate Packaging to Exceed CoWoS Limitations

TSMC Glass Substrate Packaging Transitions From Circular to Square Form Factors for Advanced AI Supply Chain Readiness

There is a huge demand in large area, complex heterogeneous integration through advanced packaging due to the proliferation of AI processors which are heavily utilizing High Bandwidth Memory. In a response to Chip on Wafer on Substrate’s physical size constraint, the TSMC is now speeding up the pace on Chip on Panel on Substrate , which utilize glass substrate instead of conventional organic substrate. The major challenge is the rate in which the glass core substrate’s yield can be improve.