{
  "$type": "site.standard.document",
  "bskyPostRef": {
    "cid": "bafyreiavgxef6qhfhz5x57y3lji56kapbjmmrcekmuenrg6z3gyxkyeezi",
    "uri": "at://did:plc:ymwilo4vyyajhi6mnl4p7m4w/app.bsky.feed.post/3mi7p7rzpl6s2"
  },
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreicv5uybp5dc4wygpoq5g3scszx4o2wwtqjbraivit3dnkc25ui4su"
    },
    "mimeType": "image/jpeg",
    "size": 40536
  },
  "path": "/2026/03/hbm-height-standard-increase-by-jedec.html",
  "publishedAt": "2026-03-29T15:29:00.000Z",
  "site": "https://www.technetbooks.com",
  "title": "HBM Height Standard Increase by JEDEC for 16 Layer AI Memory Stacks and HBM4 Manufacturing",
  "updatedAt": "2026-03-29T15:29:57.072Z"
}