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  "description": "EU — Italia · scadenza 18/03/2027",
  "path": "/finanziamento-eu-funding-tenders-16cd74b8-ee5b-4c7e-8/",
  "publishedAt": "2026-05-09T19:17:11.000Z",
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  "textContent": "## Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)\n\n### Scadenza: 18/03/2027\n\nFonte: eu_funding_tenders\n\nTipo: EU\n\n**Pagina ufficiale** : Apri la scheda sulla fonte ufficiale\n\n### Scheda (fonte ufficiale)\n\n#### Topic metadata\n\n  * **EU Programme:** Horizon Europe (ID 43108390)\n  * **Call identifier:** HORIZON-CL4-2027-05\n  * **Call name:** DIGITAL\n  * **Type:** Topic\n  * **Opening date:** 17/11/2026\n  * **Next deadline:** 18/03/2027\n  * **Keywords:** HORIZON-CL4-2027-05-DIGITAL-EMERGING-03, HORIZON-CL4-2027-05, Nanophysics: nanoelectronics, nanophotonics, nanomagnetism, nanoelectromechanics, etc., Optical engineering, photonics, lasers\n\n\n\n#### Topic description\n\nExpected Outcome:\n\n  * Advanced integrated photonic devices and circuits with enhanced functionality and performance enabling wider application across multiple sectors including digital, automotive, industrial, health and security\n  * Reinforced competitiveness of EU photonics actors by demonstrating advancements in representative system configurations and validating real-world applicability\n  * Significantly improved performance of electro-optic systems in applications such as communication, computing, sensing, medical diagnostics, data processing, AI supporting the introduction of photonic elements into such systems\n  * Low power consumption sensors with increased performance in application domains\n\n\n\nScope:\n\nR&I should enhance the functionality, efficiency, and integration of photonic devices and circuits with a focus extended system performance. Action should address at least two of the following aspects.\n\n  * Enhanced performance through improved spectral purity, wavelength coverage, output power and noise characteristics.\n  * Increased modulation or detection speeds going beyond the capability of existing PIC material platforms, improved signal-processing capabilities, and integration of novel materials such as thin-film LiNbO3, BTO, graphene, silicon carbide, phase change materials and TMDCs.\n  * Miniaturised, high-complexity photonic circuits (e.g. multilayer photonics, chiplets, multiple integrated functional elements), scalable interconnects and electronics-photonics integration (co-packaged, heterogeneous, or monolithic) to improve performance, reliability, and cost-efficiency.\n  * Reduction of power consumption for example through improved electrical-to-optical conversion, lower optical losses, devices operable at higher temperatures to reduce cooling needs, and low-power circuit actuation and control.\n\n\n\nProposals should consider system-level impact and demonstrate advancements in representative configurations relevant to one or more application domains.\n\nThis topic implements the co-programmed European Partnership on photonics.\n\nnull\n\nActivities are expected to start at TRL 3 and achieve TRL 6 by the end of the project – see General Annex B.",
  "title": "Advanced integrated photonic devices for extended features and ultra-low power consumption (RIA) (Photonics Partnership)",
  "updatedAt": "2026-05-09T19:17:15.377Z"
}