TECNO Unveils the World’s Thinnest Modular Smartphone Ecosystem Concept
home - Laotian Times [Unofficial]
February 25, 2026
A new ultra-thin magnetic architecture makes a modular smartphone system possible without added bulk. HONG KONG, Feb. 25, 2026 /PRNewswire/ — AI-driven innovative technology brand TECNO is set to unveil its groundbreaking Modular Magnetic Interconnection Technology at MWC 2026. This concept, embodied by TECNO Modular Phone, represents TECNO’s pioneering exploration of the next-generation form of […]
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