{
  "$type": "site.standard.document",
  "bskyPostRef": {
    "cid": "bafyreifp5o33cwjutawk53x66a3li56wkdil26ygbqswsibyma2havar6i",
    "uri": "at://did:plc:sr2p2g2woprvrfgwj32b3jap/app.bsky.feed.post/3mk5ektax7bk2"
  },
  "coverImage": {
    "$type": "blob",
    "ref": {
      "$link": "bafkreif6a4nkj7ch3yem3cirlc4oz4tb6v3x5o2qpdxgsvge27mi7rgdf4"
    },
    "mimeType": "image/jpeg",
    "size": 145614
  },
  "path": "/news/wirtschaft/tsmc-coupe-silicon-photonics-im-substrat-interposer-setzt-konkurrenz-zu.97024/",
  "publishedAt": "2026-04-22T19:00:00.000Z",
  "site": "https://www.computerbase.de",
  "title": "TSMC COUPE: Silicon Photonics im Substrat/Interposer setzt Konkurrenz zu",
  "updatedAt": "2026-04-22T19:00:00.000Z"
}